Rigid PCB Manufacturing in India
Multi-layer FR4 boards from 1 to 14 layers, manufactured to IPC Class 2 and Class 3 with controlled impedance and instant online quoting.
Rigid FR4 is the workhorse of electronics, and it is the core of what we fabricate: 1 to 14 layer stackups on TG135 to TG170 laminates, board thicknesses from 0.8 mm to 2.0 mm, and copper weights from 0.5 oz inner layers to 3 oz outer copper for power electronics.
Telecommunications, automotive ECUs, IoT devices, medical imaging, power electronics: rigid multi-layer boards for these industries run through the same automated quoting and DFM pipeline, priced in seconds.
Stackups and design rules
Standard design rules start at 4/4 mil trace and space. Mechanical drilling to 0.15 mm supports BGA-dense layouts, with back drilling available from 8 layers.
Surface finishes include HASL (leaded and lead-free), ENIG with 1U" or 2U" gold, and OSP. Solder mask is available in green as standard, plus black, blue, red, yellow, white, and purple.
Quality you can verify
Every rigid board is AOI-inspected, 100% electrically tested for continuity and isolation, and impedance-controlled builds are TDR-verified to ±5%. Boards are manufactured to IPC Class 2 or Class 3 acceptance criteria depending on your requirement.
Frequently Asked Questions
What layer counts do you support for rigid PCBs?
From single-layer boards up to 14-layer multi-layer stackups, with back drilling available from 8 layers.
Which FR4 grades do you use?
TG135 as standard up to 6 layers, TG155 on 8 layers and TG170 on 10 to 14 layers, with TG140 and TG155 upgrades selectable on 2 to 6 layer boards when you configure your board.
Can you manufacture heavy copper boards?
Yes. Outer layers up to 3 oz copper for power electronics and high-current applications, with inner layers of 0.5 oz, 1 oz or 2 oz.
Ready when you are.
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