RIGID PCB
MULTI-LAYER FR4
Single-sided to 14-layer boards on TG135 to TG170 FR-4, 0.8 to 2.0 mm thick, with back drilling from 8 layers and controlled impedance on multilayers.
- TG135 - TG170
- IPC Class 2

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Single-sided to 14-layer boards on TG135 to TG170 FR-4, 0.8 to 2.0 mm thick, with back drilling from 8 layers and controlled impedance on multilayers.
2 oz and 3 oz outer copper for power electronics, 0.5 to 2 oz inner layers, and single-layer aluminium metal-core boards for LED and thermal loads.
Dynamic polyimide flex circuits for wearables and aerospace applications where weight and space are critical, plus transparent PET flex for membrane switches and sensors.
Select a material category below to analyze performance metrics.
Standard FR4 epoxy-glass laminate with a 135°C glass transition temperature, the fab's default up to six layers. The cost-effective choice for consumer electronics, IoT devices, and general-purpose boards. Shown for a 4-layer configuration.
We ensure zero-defect delivery through automated inspection protocols. Every board is E-Tested for continuity and isolation.
A single .zip of Gerber RS-274X layers with Excellon drill files, as every major EDA tool exports them. Upload it on this page and the board is measured and quoted in seconds.
Yes, on multilayer boards, for single-ended and differential pairs with a tolerance of ±10%. Please include your stackup requirements in the mechanical layer.
Two-layer prototypes are typically built in 2-3 days and multilayers in 3-6 days, then shipped to you with tracking. Every quote is for bare boards at the quantity you pick, and larger quantities lower the price per board.
The instant quote covers bare boards. For assembly, write to queries@cucircuits.com with your BOM and pick-and-place files and we will quote it separately.