High Frequency PCB Manufacturing in India
RF and microwave boards with controlled impedance, TDR verification to ±5%, and low-loss laminate options for telecom, radar, and high-speed digital.
Above a few hundred megahertz, the board is part of the circuit. Dielectric constant stability, loss tangent, and impedance control decide whether your RF front-end or high-speed link works, so we treat them as manufacturing specifications, not afterthoughts.
Cu Circuits supports controlled impedance for single-ended and differential pairs at ±5% or ±10% tolerance, verified by TDR measurement, with low-loss laminates such as Rogers 4350B alongside high-Tg FR4 hybrids.
Materials for RF and high-speed work
Rogers 4350B offers a stable dielectric constant and low loss for RF/microwave stages, and hybrid stackups pair a Rogers RF layer with FR4 logic layers to control cost. Rogers capacity is being brought online; upload your stackup for current pricing and lead times.
For fast digital (SerDes, DDR, gigabit links) on FR4, tight impedance control and 3/3 mil advanced trace/space keep eye diagrams open without exotic materials.
Specify it, we verify it
Include your impedance targets and stackup in the mechanical layer. Impedance-controlled builds are TDR-verified to the ordered tolerance before shipping, alongside standard AOI and 100% electrical test.
Frequently Asked Questions
What impedance control tolerance do you offer?
±5% or ±10% for single-ended and differential pairs, with TDR verification of finished boards to the ordered tolerance.
Do you support Rogers and other low-loss laminates?
Rogers 4350B is our primary low-loss option, including hybrid Rogers/FR4 stackups; this capacity is being brought online, so upload your design or contact us to confirm current lead times.
How do I specify a high-frequency stackup?
Add your layer stackup, target impedances, and reference materials to the mechanical layer of your Gerber package. Our DFM review validates it before fabrication.
Ready when you are.
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