

Rigid component areas joined by integrated polyimide flex, eliminating connectors, saving weight, and surviving vibration in one laminated construction.
Rigid-flex boards integrate rigid FR4 sections and flexible polyimide interconnects into a single laminated assembly. The payoff: no board-to-board connectors to fail, dramatic weight and volume savings, and reliability under vibration that cabled assemblies cannot match.
That makes rigid-flex the construction of choice for aerospace avionics, defence electronics, medical implants and instruments, and premium consumer devices that fold or hinge.
The rigid-to-flex transition is where designs fail: copper must be anchored, coverlay overlaps controlled, and vias kept clear of the flex region. Include your stackup in the mechanical layer and our DFM pipeline plus engineering review will validate the transition zones before fabrication.
Rigid-flex builds combine our rigid capability (up to 14 layers) with 1, 2 or 4 layer flex sections. Capacity for complex rigid-flex constructions is being expanded; upload your design for current lead times.
Every connector you remove is a contact resistance, an assembly step, and a failure mode gone. For products that must survive shock, vibration, and thousands of flex cycles, a rigid-flex construction is usually cheaper at the system level even when the bare board costs more.
When reliability, weight, or volume matter: rigid-flex removes connectors and harnesses, survives vibration better, and packages into tighter enclosures. It is common in aerospace, medical, and folding consumer devices.
A clear stackup drawing in the mechanical layer showing rigid and flex regions, layer counts, and bend requirements. Our DFM checks validate transition zones from there.
Yes. The rigid sections support our full HDI capability including laser-drilled microvias down to 0.10 mm and pad-in-via technology.
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