

Polyimide flexible circuits for wearables, aerospace, and anywhere weight and space are critical, in 1, 2 and 4 flex layers with dynamic bending support.
Flexible circuits replace bulky wire harnesses and rigid interconnects with thin polyimide constructions that bend, fold, and survive vibration. Cu Circuits fabricates flex PCBs in 1, 2 and 4 layers, including dynamic-flex designs rated for repeated bending rather than one-time installation folds.
Typical applications include wearable electronics, camera and display interconnects, aerospace assemblies, and medical devices: anywhere a rigid board simply does not fit.
Flex designs live or die on bend-radius planning, conductor routing perpendicular to the bend, and stiffener placement under connectors. Our DFM pipeline flags common flex pitfalls when you upload, and our engineering team reviews stackup requirements included in your mechanical layer.
Polyimide flex capacity is being expanded on our line. Upload your design for current pricing and lead times, or contact queries@cucircuits.com for project-specific guidance.
Choose flex when the interconnect must move (hinges, sliders, wearables), when 3D packaging demands folding the circuit into an enclosure, or when weight budgets rule out connectors and harnesses. For designs that need both stable component areas and flexible interconnects, see our rigid-flex service.
We support 1, 2 and 4 flex layers in polyimide, plus transparent PET flex in 1 and 2 layers, including dynamic-flex constructions designed for repeated bending.
Wearables, aerospace and avionics assemblies, camera/display interconnects, and space-constrained products where a rigid board or wire harness will not fit or weighs too much.
Include your stackup and bend requirements in the mechanical layer of your Gerber package; our DFM checks and engineering review pick them up from there.
Upload your design and see your price in seconds. No signup, no sales calls.